(Mobile Tel): 0086-18589221486    E-Mail:sales@kingtechems.com

Office address:55 building, NO 4 district of hengling,Longhua,Shenzhen city.
(Mobile Tel): 0086-18589221486

CURRENT > > Capability > Rigid PCB >

Rigid PCB capability

Rigid PCB Manufacture Capabilities
Item Capability
Material Normal FR4 TG135 Shengyi S1141; KB-6160A; KB-6160
Halogen free material Shengyi S1155; Shengyi S1165; 
High Tg FR4 S1000-2;IT180A;FR408;FR408HR;IS410;FR406;PCL-370HR;N4000-13;N4000-13EP;
N4000-13SI;N4000-13EP SI;Megtron 4;Megtron 6(Panasonic);
Ceramic Particle Filled Laminates Rogers4350B、Rogers4003C、25FR、25N
PTFE Laminates Rogers series、Taconic series、Arlon series、Nelco series、TP series;
PCB Type Rigid PCB Type Backplane、HDI、High multi-layer blind&buried PCB、
Heavy copper power PCB、Backdrill.
Finish Treatment Surface Finish Flash gold(electroplated gold); ENIG; Hard gold; HASL Lead free; OSP; ENEPIG;
Immersion silver; Immersion Tin; ENIG+Gold finger; Immersion silver+Gold finger; Immersion Tin+Gold finge
Max finished size HASL Lead 22"*39";HASL Lead free 22"*24";Flash gold 24"*24";Hard gold 24"*28";ENIG 21"*27";Immersion Tin 16"*21";Immersion silver 16"*18";OSP 24"*40";
PCB Thickness HASL Lead/HASL Lead free 0.6-4.0mm;Hard gold 0.2-5.0mm;ENIG 0.2-
7.0mm;Flash gold(electroplated gold) 0.2-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm;
Width/Space Internal Layer 1/2OZ:3/3mil; 1OZ: 3/4mil; 2OZ: 4/5mil; 3OZ: 5/8mil; 4OZ: 6/11mil; 5OZ: 7/13.5mil; 6OZ: 8/15mil; 7OZ: 9/18mil
External Layer 1/2OZ:3.5/3.5mil; 1OZ: 4.5/5mil; 2OZ: 6/7mil; 3OZ: 6/10mil; 4OZ: 7.5/13mil;         5OZ: 9/16mil; 6OZ: 10/19mil; 7OZ: 11/22mil
Color Soldermask color Green matte/glossy, Yellow, Black, Blue, Red, White, Purple
Silkscreen color White, Yellow, Black
Mechanical V-CUT angle 20、30、45°
Gold finger bevelling 20、30、45、60°
routing tolerance (edge to edge) ±4mil
Others Max finished copper thickness to
internal&external layer
Internal layer: 7oz; External layer: 7oz
Layer count 1-30L
PCB thickness 0.2 - 7mm(No Soldermask); 0.4 - 7mm(Have Soldermask)
PCB thickness tolerance Thickness>1mm: ±10%; Thickness≤1mm: ±0.1mm
Max finished PCB size 23×35 inch(2L) ; 22.5*33.5 inch(4L); 22.5*30inch(≥6L)
Impedance tolerance ±5ohm(<50ohm);  ±10%(≥50ohm)
Laser blind via size with filling plating 4-5mil(priority 4mil)
Plating/coating thickness Tin thickness 1-40μm
OSP 0.2-0.6μm
ENIG Ni: 3-8μm; Au: 0.05-0.1μm
Immersion Silver 0.2-0.4μm
Immersion Tin ≥1.0μm
Hard gold 0.1-4.0μm
ENEPIG Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm
Electroplated Gold Finger Ni:≥3μm ; Au: 0.25-1.5μm
Carbon 10-50μm
Peelable mask 0.20-0.80mm