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| Rigid PCB Manufacture Capabilities | ||
| Item | Capability | |
| Material | Normal FR4 TG135 | Shengyi S1141; KB-6160A; KB-6160 |
| Halogen free material | Shengyi S1155; Shengyi S1165; | |
| High Tg FR4 |
S1000-2;IT180A;FR408;FR408HR;IS410;FR406;PCL-370HR;N4000-13;N4000-13EP; N4000-13SI;N4000-13EP SI;Megtron 4;Megtron 6(Panasonic); |
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| Ceramic Particle Filled Laminates | Rogers4350B、Rogers4003C、25FR、25N | |
| PTFE Laminates | Rogers series、Taconic series、Arlon series、Nelco series、TP series; | |
| PCB Type | Rigid PCB Type |
Backplane、HDI、High multi-layer blind&buried PCB、 Heavy copper power PCB、Backdrill. |
| Finish Treatment | Surface Finish |
Flash gold(electroplated gold); ENIG; Hard gold; HASL Lead free; OSP; ENEPIG; Immersion silver; Immersion Tin; ENIG+Gold finger; Immersion silver+Gold finger; Immersion Tin+Gold finge |
| Max finished size | HASL Lead 22"*39"；HASL Lead free 22"*24"；Flash gold 24"*24"；Hard gold 24"*28"；ENIG 21"*27"；Immersion Tin 16"*21"；Immersion silver 16"*18"；OSP 24"*40"； | |
| PCB Thickness |
HASL Lead/HASL Lead free 0.6-4.0mm；Hard gold 0.2-5.0mm；ENIG 0.2- 7.0mm；Flash gold(electroplated gold) 0.2-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm； |
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| Width/Space | Internal Layer | 1/2OZ:3/3mil; 1OZ: 3/4mil; 2OZ: 4/5mil; 3OZ: 5/8mil; 4OZ: 6/11mil; 5OZ: 7/13.5mil; 6OZ: 8/15mil; 7OZ: 9/18mil |
| External Layer | 1/2OZ:3.5/3.5mil; 1OZ: 4.5/5mil; 2OZ: 6/7mil; 3OZ: 6/10mil; 4OZ: 7.5/13mil; 5OZ: 9/16mil; 6OZ: 10/19mil; 7OZ: 11/22mil | |
| Color | Soldermask color | Green matte/glossy, Yellow, Black, Blue, Red, White, Purple |
| Silkscreen color | White, Yellow, Black | |
| Mechanical | V-CUT angle | 20、30、45° |
| Gold finger bevelling | 20、30、45、60° | |
| routing tolerance (edge to edge) | ±4mil | |
| Others |
Max finished copper thickness to internal&external layer |
Internal layer: 7oz; External layer: 7oz |
| Layer count | 1-30L | |
| PCB thickness | 0.2 - 7mm(No Soldermask); 0.4 - 7mm(Have Soldermask) | |
| PCB thickness tolerance | Thickness＞1mm: ±10%; Thickness≤1mm: ±0.1mm | |
| Max finished PCB size | 23×35 inch(2L) ; 22.5*33.5 inch(4L); 22.5*30inch（≥6L） | |
| Impedance tolerance | ±5ohm(＜50ohm); ±10%(≥50ohm) | |
| Laser blind via size with filling plating | 4-5mil(priority 4mil) | |
| Plating/coating thickness | Tin thickness | 1-40μm |
| OSP | 0.2-0.6μm | |
| ENIG | Ni: 3-8μm; Au: 0.05-0.1μm | |
| Immersion Silver | 0.2-0.4μm | |
| Immersion Tin | ≥1.0μm | |
| Hard gold | 0.1-4.0μm | |
| ENEPIG | Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm | |
| Electroplated Gold Finger | Ni:≥3μm ; Au: 0.25-1.5μm | |
| Carbon | 10-50μm | |
| Peelable mask | 0.20-0.80mm | |