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Rigid-Flex PCB capability

Rigid-flex PCB Capabilities
Shengyi adhesive FCCL Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz
Panasonic adhesiveless FCCL Panasonic R-F775(ER):PI=1mil&2mill&3mil; Cu=0.33oz&0.5oz &1oz&2oz
DuPont adhesiveless FCCL DuPont Pyralux AP:PI=1mil&2mil&3mil&4mil; Cu= 0.5oz&1oz&2oz
3M Type 9077; 6677;9458
Layer Count 2-20(18 flex layers max)
Board thickness 0.3mm‐4.0mm
Min. board size 10mm*15mm
Max. board size 400mm*700mm
Impedance control tolerance ±5Ω(≤50Ω),±10%(>50Ω)
HDI Structure 1+n+1(buried via≤0.4mm)
Bow&twist 0.75%(symmetrical); 2%(unsymmetrical)
Max. inner copper thickness 3oz
Min. BGA pad size 10mil
Max. finished outer copper thickness 5oz
Blind via 4mil-6mil(6mil preferred)
Max. buried via 0.4mm
Aspect ratio 12:1
Tolerance of non-plated holes  +/-0.05mm
Solder mask color green,blue,red, matte green,white,black ,matte black
silk color white,yellow,black
Surface treatment HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold,
Hard Gold, Immersion silver, Immersion tin and OSP
Mixed surface treatment ENIG+OSP,ENIG+Gold finger,Electrical gold+ Gold fingers
Gold thickness (ENIG) 0.05-0.10um
Nickel thickness (ENIG) 3-6um
Hard gold thickness 0.1-1.5um
Immersion silver thickness 0.2-0.4um
OSP thickness 0.1-0.3um
Tolerance of board outline  +/-0.13mm