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| Rigid-flex PCB Capabilities | |
| Shengyi adhesive FCCL | Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz |
| Panasonic adhesiveless FCCL | Panasonic R-F775(ER):PI=1mil&2mill&3mil; Cu=0.33oz&0.5oz &1oz&2oz |
| DuPont adhesiveless FCCL | DuPont Pyralux AP:PI=1mil&2mil&3mil&4mil; Cu= 0.5oz&1oz&2oz |
| 3M Type | 9077; 6677;9458 |
| Layer Count | 2-20(18 flex layers max) |
| Board thickness | 0.3mm‐4.0mm |
| Min. board size | 10mm*15mm |
| Max. board size | 400mm*700mm |
| Impedance control tolerance | ±5Ω(≤50Ω),±10%(>50Ω) |
| HDI Structure | 1+n+1(buried via≤0.4mm) |
| Bow&twist | 0.75%(symmetrical); 2%(unsymmetrical) |
| Max. inner copper thickness | 3oz |
| Min. BGA pad size | 10mil |
| Max. finished outer copper thickness | 5oz |
| Blind via | 4mil-6mil(6mil preferred) |
| Max. buried via | 0.4mm |
| Aspect ratio | 12:1 |
| Tolerance of non-plated holes | +/-0.05mm |
| Solder mask color | green,blue,red, matte green,white,black ,matte black |
| silk color | white,yellow,black |
| Surface treatment |
HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion silver, Immersion tin and OSP |
| Mixed surface treatment | ENIG+OSP,ENIG+Gold finger,Electrical gold+ Gold fingers |
| Gold thickness (ENIG) | 0.05-0.10um |
| Nickel thickness (ENIG) | 3-6um |
| Hard gold thickness | 0.1-1.5um |
| Immersion silver thickness | 0.2-0.4um |
| OSP thickness | 0.1-0.3um |
| Tolerance of board outline | +/-0.13mm |