

| Flex PCB Capability | |
| Shengyi FCCL | SF305; SF325; SF201; SF202; SF201A |
| Taiflex FCCL | NDIR050513HJY; IDIR051013HJY; NDIR100520HJY; THKD200520JY |
| Panasonic FCCL | R-F775 11RB-M; R-F775 22RB-M; R-F775 21RB-M |
| DuPont FCCL | AL9111R; AP9121R; AP9131R; AP8525R |
| 3M Type | 9077; 6677; 9058 |
| Layer Count | 1L-8L |
| Thickness without stiffener | 0.05-0.8mm |
| Max board size | 9*14 inch |
| Min board size | 5*10mm |
| Dimension Tolerance | +/-4mil |
| Min diameter of holes | 0.1mm (Laser drill); 0.15mm(Mechanical drill) |
| Max Aspect Ratio | 15:1 |
| Surface finish | ENIG; GOLD Finger; Flash gold; HASL; Immersion Tin; Immersion Sliver; OSP; Hard gold |
| HDI structure | 1+n+1 |
| Routing Tolerance | ±0.05mm (Laser cutting); ±0.13mm (Punching) |
| Surface treatment thickness | Immersion silver thickness: 0.2‐0.4um OSP thickness: 0.1‐0.3um Hard gold thickness: 0.1‐1.5um Gold thickness (ENIG): 0.05‐0.10um Nickel thickness (ENIG): 3‐6um |
| Silkscreen color | white; yellow |
| Max. finished copper thickness | 3OZ |
| Impedance control tolerance | ±5Ω(≤50Ω); ±10%(>50Ω) |